(kicad_pcb (version 4) (host pcbnew 4.0.2-stable)
  (general
    (links 61)
    (no_connects 0)
    (area 117.018999 66.218999 157.301001 106.501001)
    (thickness 1.6)
    (drawings 13)
    (tracks 131)
    (zones 0)
    (modules 30)
    (nets 13)
  )
  (page A4)
  (layers
    (0 F.Cu mixed)
    (31 B.Cu mixed)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (44 Edge.Cuts user)
  )
  (setup
    (last_trace_width 0.3)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (user_trace_width 0.6)
    (user_trace_width 0.8)
    (user_trace_width 1)
    (user_trace_width 1.5)
    (user_trace_width 2)
    (user_trace_width 2.5)
    (trace_clearance 0.15)
    (zone_clearance 0.254)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.3)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1 1)
    (mod_edge_width 0.15)
    (mod_text_size 0.8 0.8)
    (mod_text_width 0.2)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements 7FFEFFFF)
    (pcbplotparams
      (layerselection 0x010f0_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.150000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerber/))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +12V)
  (net 3 "Net-(C4-Pad1)")
  (net 4 "Net-(C5-Pad1)")
  (net 5 "Net-(C6-Pad1)")
  (net 6 "Net-(C7-Pad1)")
  (net 7 "Net-(C7-Pad2)")
  (net 8 "Net-(C8-Pad1)")
  (net 9 +5V)
  (net 10 "Net-(D2-Pad2)")
  (net 11 /ENABLE)
  (net 12 "Net-(R2-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.15)
    (trace_width 0.3)
    (via_dia 0.6)
    (via_drill 0.3)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +12V)
    (add_net +5V)
    (add_net /ENABLE)
    (add_net GND)
    (add_net "Net-(C4-Pad1)")
    (add_net "Net-(C5-Pad1)")
    (add_net "Net-(C6-Pad1)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(C7-Pad2)")
    (add_net "Net-(C8-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(R2-Pad2)")
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57EA64A2)
    (at 123.698 95.504 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 0.127 -1.778 180) (layer B.SilkS))
    (fp_text value 35k7 (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 5818623B)
    (at 121.92 71.12)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P1 (at 0 -3.8) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 58186237)
    (at 152.4 71.12)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P2 (at 0 -3.8) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 58186234)
    (at 121.92 101.6)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P3 (at 4.572 0.127) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 58186231)
    (at 152.4 101.6)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P4 (at 0 -3.8) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Capacitors_Tantalum_SMD:TantalC_SizeD_EIA-7343_Reflow (layer B.Cu) (tedit 57ECC3E3)
    (at 139.192 90.17 90)
    (descr "Tantal Cap. , Size D, EIA-7343, Reflow")
    (tags "Tantal Capacitor Size-D EIA-7343 Reflow")
    (attr smd)
    (fp_text reference C1 (at 1.651 3.302 90) (layer B.SilkS))
    (fp_text value 22u (at -0.09906 -3.59918 90) (layer B.Fab))
    (pad 2 smd rect (at 3.12 0 90) (size 2.37 2.43) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -3.12 0 90) (size 2.37 2.43) (layers B.Cu B.Paste B.Mask)
      (net 2 +12V))
    (model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeD_EIA-7343_Reflow.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57ECC3F8)
    (at 141.478 91.567 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at -3.937 0 90) (layer B.SilkS))
    (fp_text value 3u3 (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +12V))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57ECC3F4)
    (at 143.383 91.567 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at -3.937 0.127 90) (layer B.SilkS))
    (fp_text value 1u (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +12V))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57EA64B5)
    (at 126.492 94.742 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 18pF (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57EA64AD)
    (at 122.682 92.71 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C5 (at 0 1.905 90) (layer B.SilkS))
    (fp_text value 680pF (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57EA64D6)
    (at 134.112 98.298 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C6 (at 0 -1.778 180) (layer B.SilkS))
    (fp_text value 8n2 (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C6-Pad1)"))
    (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57EA64C7)
    (at 127.889 90.932)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at -2.794 0.127 180) (layer B.SilkS))
    (fp_text value 100n (at 0 -2.1) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad1)"))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C7-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_Tantalum_SMD:TantalC_SizeC_EIA-6032_Reflow (layer B.Cu) (tedit 57EA6502)
    (at 131.318 81.534)
    (descr "Tantal Cap. , Size C, EIA-6032, Reflow")
    (tags "Tantal Capacitor Size-C EIA-6032 Reflow")
    (attr smd)
    (fp_text reference C8 (at -0.127 -2.54) (layer B.SilkS))
    (fp_text value 22u (at 0 -2.9) (layer B.Fab))
    (pad 2 smd rect (at 2.47 0) (size 2.37 2.23) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -2.47 0) (size 2.37 2.23) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C8-Pad1)"))
    (model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeC_EIA-6032_Reflow.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitors_SMD:C_1206 (layer B.Cu) (tedit 5415D7BD)
    (at 123.19 83.058 180)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C9 (at 0 2.3 180) (layer B.SilkS))
    (fp_text value 1u5 (at 0 -2.3 180) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0 180) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 1.5 0 180) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_Tantalum_SMD:TantalC_SizeB_EIA-3528_Reflow (layer B.Cu) (tedit 555EF748)
    (at 138.43 80.518 270)
    (descr "Tantal Cap. , Size B, EIA-3528, Reflow")
    (tags "Tantal Capacitor Size-B EIA-3528 Reflow")
    (attr smd)
    (fp_text reference C10 (at 0 2.6 270) (layer B.SilkS))
    (fp_text value 22u (at 0 -2.7 270) (layer B.Fab))
    (pad 2 smd rect (at 1.46 0 270) (size 1.8 2.23) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.46 0 270) (size 1.8 2.23) (layers B.Cu B.Paste B.Mask)
      (net 9 +5V))
    (model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeB_EIA-3528_Reflow.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitors_SMD:C_1206 (layer B.Cu) (tedit 58186294)
    (at 141.986 80.899 270)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C11 (at 0.127 -1.778 270) (layer B.SilkS))
    (fp_text value 1u5 (at 0 -2.3 270) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0 270) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 9 +5V))
    (pad 2 smd rect (at 1.5 0 270) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diodes_SMD:DO-214AB (layer B.Cu) (tedit 57ECC9EB)
    (at 131.699 86.741)
    (descr "Jedec DO-214AB diode package. Designed according to Fairchild SS32 datasheet.")
    (tags "DO-214AB diode")
    (attr smd)
    (fp_text reference D1 (at 4.318 2.667) (layer B.SilkS))
    (fp_text value D_Schottky (at 0 -4.6) (layer B.Fab))
    (pad 2 smd rect (at 3.6 0) (size 2.6 3.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -3.6 0) (size 2.6 3.2) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad1)"))
    (model Diodes_SMD.3dshapes/DO-214AB.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.39 0.39 0.39))
      (rotate (xyz 0 0 180))
    )
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 149.098 93.98 180)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J1 (at -5.842 0 270) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 2 +12V))
    (pad 1 thru_hole rect (at 2.54 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 2 +12V))
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 149.098 88.9 180)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J2 (at -5.842 0 270) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
    (pad 1 thru_hole rect (at 2.54 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 149.098 78.74 180)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J3 (at -5.842 0 270) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 9 +5V))
    (pad 1 thru_hole rect (at 2.54 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 9 +5V))
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 149.098 83.82 180)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J4 (at -5.842 0 270) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
    (pad 1 thru_hole rect (at 2.54 0 270) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Inductors_NEOSID:Inductor_XAL4030-472MEB (layer B.Cu) (tedit 57EA64D0)
    (at 123.19 87.884 90)
    (descr Inductor)
    (tags Inductor)
    (attr smd)
    (fp_text reference L1 (at 0 -2.921 90) (layer B.SilkS))
    (fp_text value 4.7uH (at -0.35052 -3.64998 90) (layer B.Fab))
    (pad 1 smd rect (at -1.09982 0 90) (size 1.00076 3.70002) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad1)"))
    (pad 2 smd rect (at 1.09982 0 90) (size 1.00076 3.70002) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C8-Pad1)"))
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57EA6508)
    (at 134.112 78.232)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference L2 (at -0.127 -2.032) (layer B.SilkS))
    (fp_text value 240nH (at 0 -2.1) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 9 +5V))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x01 (layer F.Cu) (tedit 57EA64DC)
    (at 130.429 101.473)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P5 (at 0 -2.54) (layer F.SilkS))
    (fp_text value CONN_01X01 (at 0 -3.1) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 2.2352 2.2352) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 11 /ENABLE))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57EA6497)
    (at 120.142 92.837)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at 0.254 -1.651) (layer B.SilkS))
    (fp_text value 10k2 (at 0 -2.1) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(R2-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57EA649C)
    (at 120.142 95.377 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R3 (at 0.254 -1.905 180) (layer B.SilkS))
    (fp_text value 1k93 (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(R2-Pad2)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 581861AA)
    (at 139.319 74.803 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R4 (at 0.127 1.905 90) (layer B.SilkS))
    (fp_text value 1k2 (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 9 +5V))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:8-PowerSOIC_Pitch1.27mm (layer B.Cu) (tedit 57E930E2)
    (at 132.334 94.234 180)
    (descr "8-Lead Thermally Enhanced Plastic Small Outline (SE) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U1 (at 0 3.5 180) (layer B.SilkS))
    (fp_text value TPS54332 (at 0 -3.5 180) (layer B.Fab))
    (pad 9 smd rect (at -0.58928 1.17856 180) (size 1.175 1.175) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at 0.58674 1.17856 180) (size 1.175 1.175) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 1 smd rect (at -2.875 1.905 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C7-Pad2)"))
    (pad 2 smd rect (at -2.875 0.635 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 +12V))
    (pad 3 smd rect (at -2.875 -0.635 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 11 /ENABLE))
    (pad 4 smd rect (at -2.875 -1.905 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C6-Pad1)"))
    (pad 5 smd rect (at 2.875 -1.905 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(R2-Pad2)"))
    (pad 6 smd rect (at 2.875 -0.635 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 7 smd rect (at 2.875 0.635 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 8 smd rect (at 2.875 1.905 180) (size 2.15 0.6) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad1)"))
    (pad 9 smd rect (at 0.5875 -1.1717 180) (size 1.175 1.175) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at 0.5875 0.0033 180) (size 1.175 1.175) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.5875 -1.1717 180) (size 1.175 1.175) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.5875 0.0033 180) (size 1.175 1.175) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 thru_hole circle (at -0.508 0 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 1 GND))
    (pad 9 thru_hole circle (at 0.5715 0 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 1 GND))
    (pad 9 thru_hole circle (at -0.508 -1.143 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 1 GND))
    (pad 9 thru_hole circle (at 0.5715 -1.143 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 1 GND))
    (pad 9 thru_hole circle (at -0.5715 1.2065 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 1 GND))
    (pad 9 thru_hole circle (at 0.5715 1.2065 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 1 GND))
    (model Housings_SOIC.3dshapes/SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_ThroughHole:C_Radial_D6.3_L11.2_P2.5 (layer F.Cu) (tedit 0)
    (at 138.811 98.806 270)
    (descr "Radial Electrolytic Capacitor, Diameter 6.3mm x Length 11.2mm, Pitch 2.5mm")
    (tags "Electrolytic Capacitor")
    (fp_text reference C12 (at 1.25 -4.4 270) (layer F.SilkS))
    (fp_text value 47u (at 1.25 4.4 270) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.5 0 270) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask F.SilkS)
      (net 2 +12V))
    (model Capacitors_ThroughHole.3dshapes/C_Radial_D6.3_L11.2_P2.5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LEDs:LED_0805 (layer F.Cu) (tedit 581861A0)
    (at 136.652 71.12)
    (descr "LED 0805 smd package")
    (tags "LED 0805 SMD")
    (attr smd)
    (fp_text reference D2 (at 0 2.032) (layer F.SilkS))
    (fp_text value "POWER OUT" (at 0 1.75) (layer F.Fab))
    (pad 2 smd rect (at 1.04902 0 180) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (pad 1 smd rect (at -1.04902 0 180) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model LEDs.3dshapes/LED_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text VOUT (at 146.304 75.184) (layer F.SilkS))
  (gr_text VIN (at 146.05 97.79) (layer F.SilkS))
  (gr_text - (at 140.843 89.027) (layer F.SilkS))
  (gr_text - (at 140.97 83.82) (layer F.SilkS))
  (gr_text + (at 140.716 93.853) (layer F.SilkS))
  (gr_text + (at 140.97 78.613) (layer F.SilkS))
  (gr_text . (at 136.652 91.186) (layer B.SilkS))
  (gr_text "POWER OUT" (at 136.906 68.834) (layer F.SilkS))
  (gr_line (start 157.226 66.294) (end 117.094 66.294) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 157.226 106.426) (end 157.226 66.294) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 117.094 106.426) (end 157.226 106.426) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 117.094 66.294) (end 117.094 106.426) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_text STEPDOWN2A (at 137.414 104.648) (layer F.SilkS))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 157.226 106.426) (xy 117.094 106.426) (xy 117.094 66.294) (xy 157.226 66.294) (xy 157.226 106.426)
      )
    )
  )
  (zone (net 2) (net_name +12V) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 153.924 92.583) (xy 153.924 95.377) (xy 153.543 95.885) (xy 141.732 95.885) (xy 141.097 96.52)
        (xy 141.097 98.679) (xy 140.335 99.441) (xy 138.049 99.441) (xy 138.049 95.123) (xy 137.922 94.996)
        (xy 136.779 93.98) (xy 134.112 93.98) (xy 134.112 93.218) (xy 136.398 93.218) (xy 137.541 92.075)
        (xy 153.416 92.075) (xy 153.924 92.583)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 157.226 106.426) (xy 117.094 106.426) (xy 117.094 66.294) (xy 157.226 66.294) (xy 157.226 106.426)
      )
    )
  )
  (zone (net 9) (net_name +5V) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 153.924 77.216) (xy 153.924 80.391) (xy 153.67 80.645) (xy 144.399 80.645) (xy 143.129 79.883)
        (xy 135.636 79.883) (xy 134.747 78.994) (xy 134.747 77.343) (xy 135.382 76.835) (xy 153.543 76.835)
        (xy 153.924 77.216)
      )
    )
  )
  (zone (net 6) (net_name "Net-(C7-Pad1)") (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 129.413 85.217) (xy 129.413 88.646) (xy 128.016 89.789) (xy 127.762 89.789) (xy 127.381 90.17)
        (xy 127.381 91.821) (xy 127.508 91.948) (xy 130.556 91.948) (xy 130.556 92.71) (xy 125.222 92.71)
        (xy 124.587 92.202) (xy 124.587 91.821) (xy 123.698 90.805) (xy 123.063 90.805) (xy 122.428 90.17)
        (xy 121.539 90.17) (xy 121.285 89.789) (xy 121.285 88.519) (xy 121.412 88.392) (xy 126.365 88.392)
        (xy 126.619 88.138) (xy 126.619 85.217) (xy 126.873 84.963) (xy 129.159 84.963) (xy 129.413 85.217)
      )
    )
  )
  (zone (net 8) (net_name "Net-(C8-Pad1)") (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
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        (xy 124.968 87.249) (xy 121.285 87.249) (xy 121.285 87.122) (xy 121.158 86.995) (xy 121.158 85.09)
        (xy 121.666 84.582) (xy 123.825 84.582) (xy 124.206 84.201) (xy 124.206 81.788) (xy 124.46 81.534)
        (xy 125.984 81.534) (xy 127.508 80.01) (xy 127.508 78.359) (xy 128.778 76.962) (xy 132.969 76.962)
        (xy 133.477 77.47)
      )
    )
  )
)
