(kicad_pcb (version 4) (host pcbnew 4.0.2-stable)
  (general
    (links 93)
    (no_connects 1)
    (area 123.368999 70.790999 163.651001 111.073001)
    (thickness 1.6)
    (drawings 15)
    (tracks 293)
    (zones 0)
    (modules 38)
    (nets 17)
  )
  (page A4)
  (layers
    (0 F.Cu mixed)
    (31 B.Cu mixed)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user hide)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (44 Edge.Cuts user)
  )
  (setup
    (last_trace_width 0.3)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (user_trace_width 0.6)
    (user_trace_width 0.8)
    (user_trace_width 1)
    (user_trace_width 1.5)
    (user_trace_width 2)
    (user_trace_width 2.5)
    (trace_clearance 0.15)
    (zone_clearance 0.254)
    (zone_45_only yes)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.3)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1 1)
    (mod_edge_width 0.15)
    (mod_text_size 0.8 0.8)
    (mod_text_width 0.2)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements 7FFEFFFF)
    (pcbplotparams
      (layerselection 0x010f0_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.150000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerber/))
  )
  (net 0 "")
  (net 1 +48V)
  (net 2 "Net-(C5-Pad1)")
  (net 3 "Net-(C6-Pad1)")
  (net 4 "Net-(C6-Pad2)")
  (net 5 "Net-(C7-Pad1)")
  (net 6 "Net-(C7-Pad2)")
  (net 7 +24V)
  (net 8 "Net-(C9-Pad1)")
  (net 9 "Net-(C11-Pad2)")
  (net 10 /SYNCH)
  (net 11 "Net-(R2-Pad1)")
  (net 12 "Net-(D2-Pad2)")
  (net 13 "Net-(R8-Pad1)")
  (net 14 GND)
  (net 15 /EN)
  (net 16 "Net-(C10-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.15)
    (trace_width 0.3)
    (via_dia 0.6)
    (via_drill 0.3)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +24V)
    (add_net +48V)
    (add_net /EN)
    (add_net /SYNCH)
    (add_net GND)
    (add_net "Net-(C10-Pad1)")
    (add_net "Net-(C11-Pad2)")
    (add_net "Net-(C5-Pad1)")
    (add_net "Net-(C6-Pad1)")
    (add_net "Net-(C6-Pad2)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(C7-Pad2)")
    (add_net "Net-(C9-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(R2-Pad1)")
    (add_net "Net-(R8-Pad1)")
  )
  (module Inductors:SELF-WE-PD-XXL (layer B.Cu) (tedit 57DA7BD4)
    (at 153.67 96.52)
    (descr "SELF- WE-PD-XXL")
    (attr smd)
    (fp_text reference L1 (at -6.985 4.699 180) (layer B.SilkS))
    (fp_text value 15uH (at 1.80086 0 270) (layer B.Fab))
    (fp_text user "" (at 0 0) (layer B.SilkS))
    (fp_text user "" (at 0 0) (layer B.SilkS))
    (pad 1 smd rect (at -5.00126 0) (size 2.90068 5.40004) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C6-Pad1)"))
    (pad 2 smd rect (at 5.00126 0) (size 2.90068 5.40004) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (model Inductors.3dshapes/SELF-WE-PD-XXL.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57DA7BBC)
    (at 148.971 78.994 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 2.413 0 180) (layer B.SilkS))
    (fp_text value 0R (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 1 +48V))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 15 /EN))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 130.81 93.726)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J4 (at -5.842 0 90) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
    (pad 1 thru_hole rect (at 2.54 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
  )
  (module Housings_SSOP:TSSOP-16-1EP-VIA_4.4x5mm_Pitch0.65mm (layer B.Cu) (tedit 57DA7BE0)
    (at 150.368 86.106 270)
    (descr "FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 1.143 3.556 270) (layer B.SilkS))
    (fp_text value L7987 (at 0 -3.55 270) (layer B.Fab))
    (pad 1 smd rect (at -2.775 2.275 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at -2.775 1.625 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 1 +48V))
    (pad 3 smd rect (at -2.775 0.975 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 1 +48V))
    (pad 4 smd rect (at -2.775 0.325 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 15 /EN))
    (pad 5 smd rect (at -2.775 -0.325 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 15 /EN))
    (pad 6 smd rect (at -2.775 -0.975 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(C5-Pad1)"))
    (pad 7 smd rect (at -2.775 -1.625 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 10 /SYNCH))
    (pad 8 smd rect (at -2.775 -2.275 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C7-Pad1)"))
    (pad 9 smd rect (at 2.775 -2.275 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad2)"))
    (pad 10 smd rect (at 2.775 -1.625 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(R2-Pad1)"))
    (pad 11 smd rect (at 2.775 -0.975 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(R8-Pad1)"))
    (pad 12 smd rect (at 2.775 -0.325 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask))
    (pad 13 smd rect (at 2.775 0.325 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C6-Pad1)"))
    (pad 14 smd rect (at 2.775 0.975 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C6-Pad1)"))
    (pad 15 smd rect (at 2.775 1.625 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C6-Pad2)"))
    (pad 16 smd rect (at 2.775 2.275 270) (size 1.05 0.45) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (pad 17 smd rect (at 0.735 -1.3425 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at 0.735 -0.4475 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at 0.735 0.4475 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at 0.735 1.3425 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at -0.735 -1.3425 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at -0.735 -0.4475 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at -0.735 0.4475 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at -0.735 1.3425 270) (size 1.47 0.895) (layers B.Cu B.Paste B.Mask)
      (net 14 GND) (solder_paste_margin_ratio -0.2))
    (pad 17 thru_hole circle (at -1.143 1.397 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at -0.381 1.397 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 0.381 1.397 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at -1.143 0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at -0.381 0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 1.143 1.397 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at -1.143 -0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 0.381 0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 1.143 0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at -1.143 -1.27 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at -0.381 -0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 0.381 -0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 1.143 -0.381 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at -0.381 -1.27 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 0.381 -1.27 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (pad 17 thru_hole circle (at 1.143 -1.27 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask B.SilkS)
      (net 14 GND))
    (model Housings_SSOP.3dshapes/TSSOP-16-1EP_4.4x5mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 57908607)
    (at 128.27 106.172)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P1 (at 2.794 3.302) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 5790860C)
    (at 128.27 75.692)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P2 (at 3.302 2.286) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 57908604)
    (at 158.75 106.172)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P3 (at -3.048 3.302) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3_DIN965_Pad (layer F.Cu) (tedit 57D6864B)
    (at 158.75 75.692)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (fp_text reference P4 (at 2.54 3.048) (layer F.SilkS) hide)
    (fp_text value _NC (at 0 3.8) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57E8CA22)
    (at 143.637 78.74 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at 3.556 0.127 180) (layer B.SilkS))
    (fp_text value 3u3 (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 +48V))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57E8CA24)
    (at 141.351 78.74 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at 3.556 0.127 180) (layer B.SilkS))
    (fp_text value 1u (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 +48V))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57DA7BB8)
    (at 151.511 78.994 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at -2.413 0 360) (layer B.SilkS))
    (fp_text value 1u (at 0 -2.1 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 15 /EN))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57DA7BCA)
    (at 153.797 78.994 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C5 (at 2.413 0 180) (layer B.SilkS))
    (fp_text value 150n (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(C5-Pad1)"))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57D6866E)
    (at 144.526 88.138)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C6 (at -3.556 0.254) (layer B.SilkS))
    (fp_text value 100n (at 0 -2.1) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C6-Pad1)"))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C6-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57E8CA7A)
    (at 155.956 84.582)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at -2.286 0.127 90) (layer B.SilkS))
    (fp_text value 390p (at 0 -2.1) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C7-Pad1)"))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57D6866B)
    (at 144.272 83.312 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C8 (at 3.556 0 180) (layer B.SilkS))
    (fp_text value 1u (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57E8CA63)
    (at 155.956 86.868 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C9 (at 2.159 0 450) (layer B.SilkS))
    (fp_text value 33n (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C9-Pad1)"))
    (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C7-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 57D6885D)
    (at 159.512 82.042 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C11 (at -1.27 1.778 180) (layer B.SilkS))
    (fp_text value 470p (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(C11-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diodes_SMD:DO-214AB (layer B.Cu) (tedit 579082DE)
    (at 141.732 92.71 180)
    (descr "Jedec DO-214AB diode package. Designed according to Fairchild SS32 datasheet.")
    (tags "DO-214AB diode")
    (attr smd)
    (fp_text reference D1 (at 0 0 180) (layer B.SilkS))
    (fp_text value STPS3L60 (at 0 -4.6 180) (layer B.Fab))
    (pad 2 smd rect (at 3.6 0 180) (size 2.6 3.2) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (pad 1 smd rect (at -3.6 0 180) (size 2.6 3.2) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C6-Pad1)"))
    (model Diodes_SMD.3dshapes/DO-214AB.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.39 0.39 0.39))
      (rotate (xyz 0 0 180))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57E8CA0F)
    (at 155.956 89.408)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at -2.413 0.762) (layer B.SilkS))
    (fp_text value 16k9 (at 0 -2.1) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(R2-Pad1)"))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57D6886A)
    (at 159.512 86.868 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R3 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 750R (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad2)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C9-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57D68859)
    (at 159.512 84.582 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R4 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 18k (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57E8CA19)
    (at 155.956 82.042 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R5 (at 0.508 1.524 180) (layer B.SilkS))
    (fp_text value 620R (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad2)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57D68645)
    (at 157.734 79.756 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R6 (at 2.032 1.524 180) (layer B.SilkS))
    (fp_text value 680R (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(C11-Pad2)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C7-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LEDs:LED_0805 (layer F.Cu) (tedit 57D68C01)
    (at 144.526 86.36 270)
    (descr "LED 0805 smd package")
    (tags "LED 0805 SMD")
    (attr smd)
    (fp_text reference D2 (at 0 1.778 270) (layer F.SilkS))
    (fp_text value "POWER OUT" (at 0 -1.524 270) (layer F.SilkS))
    (pad 2 smd rect (at 1.04902 0 90) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D2-Pad2)"))
    (pad 1 smd rect (at -1.04902 0 90) (size 1.19888 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (model LEDs.3dshapes/LED_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57E8C9F7)
    (at 144.272 85.725 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R7 (at 3.683 -0.508 180) (layer B.SilkS))
    (fp_text value 3k3 (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 7 +24V))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D2-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 130.81 83.566)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J1 (at -5.842 0 90) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 1 +48V))
    (pad 1 thru_hole rect (at 2.54 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 1 +48V))
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 130.81 88.646)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J2 (at -5.842 0 90) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
    (pad 1 thru_hole rect (at 2.54 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
  )
  (module Connect:WAGO256 (layer F.Cu) (tedit 56E580D1)
    (at 130.81 98.806)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J3 (at -5.842 0 90) (layer F.SilkS) hide)
    (fp_text value CONN1_1 (at 0.254 4.064) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 7 +24V))
    (pad 1 thru_hole rect (at 2.54 0 90) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 7 +24V))
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57D68856)
    (at 159.512 89.408)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R8 (at 2.54 0) (layer B.SilkS))
    (fp_text value 0R (at 0 -2.1) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(R8-Pad1)"))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_Tantalum_SMD:TantalC_SizeC_EIA-6032_HandSoldering (layer B.Cu) (tedit 57DA7BF3)
    (at 143.256 107.061 180)
    (descr "Tantal Cap. , Size C, EIA-6032, Hand Soldering,")
    (tags "Tantal Cap. , Size C, EIA-6032, Hand Soldering,")
    (attr smd)
    (fp_text reference C12 (at -0.381 -2.667 180) (layer B.SilkS))
    (fp_text value 33u (at -0.09906 -3.59918 180) (layer B.Fab))
    (fp_text user + (at -5.75056 2.19964 180) (layer B.SilkS))
    (pad 2 smd rect (at 2.99974 0 180) (size 3.50012 1.80086) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (pad 1 smd rect (at -2.99974 0 180) (size 3.50012 1.80086) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeC_EIA-6032_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 57D685F4)
    (at 142.24 103.124 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference L2 (at 0 1.778 180) (layer B.SilkS))
    (fp_text value 240nH (at 0 -2.1 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 7 +24V))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x02 (layer F.Cu) (tedit 57E8C9BB)
    (at 151.384 74.041 90)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P5 (at 0 -2.413 90) (layer F.SilkS) hide)
    (fp_text value CONN_01X02 (at 0 -3.1 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 15 /EN))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 10 /SYNCH))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x02.wrl
      (at (xyz 0 -0.05 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Capacitors_Tantalum_SMD:TantalC_SizeC_EIA-6032_HandSoldering (layer B.Cu) (tedit 57D685EE)
    (at 141.605 98.806)
    (descr "Tantal Cap. , Size C, EIA-6032, Hand Soldering,")
    (tags "Tantal Cap. , Size C, EIA-6032, Hand Soldering,")
    (attr smd)
    (fp_text reference C14 (at -0.254 -2.286) (layer B.SilkS))
    (fp_text value 33u (at -0.09906 -3.59918) (layer B.Fab))
    (fp_text user + (at -5.75056 2.19964) (layer B.SilkS))
    (pad 2 smd rect (at 2.99974 0) (size 3.50012 1.80086) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (pad 1 smd rect (at -2.99974 0) (size 3.50012 1.80086) (layers B.Cu B.Paste B.Mask)
      (net 7 +24V))
    (model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeC_EIA-6032_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitors_ThroughHole:C_Radial_D6.3_L11.2_P2.5 (layer F.Cu) (tedit 57E8C9C0)
    (at 146.431 79.248 90)
    (descr "Radial Electrolytic Capacitor, Diameter 6.3mm x Length 11.2mm, Pitch 2.5mm")
    (tags "Electrolytic Capacitor")
    (fp_text reference C16 (at 5.715 0 180) (layer F.SilkS))
    (fp_text value 47u (at 1.25 4.4 90) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.5 0 90) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask F.SilkS)
      (net 14 GND))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask F.SilkS)
      (net 1 +48V))
    (model Capacitors_ThroughHole.3dshapes/C_Radial_D6.3_L11.2_P2.5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_Tantalum_SMD:TantalC_SizeD_EIA-7343_HandSoldering (layer B.Cu) (tedit 57E8C981)
    (at 137.668 78.613 90)
    (descr "Tantal Cap. , Size D, EIA-7343, Hand Soldering,")
    (tags "Tantal Cap. , Size D, EIA-7343, Hand Soldering,")
    (attr smd)
    (fp_text reference C1 (at 0 -4.064 90) (layer B.SilkS))
    (fp_text value 33u (at -0.09906 -3.59918 90) (layer B.Fab))
    (fp_text user + (at -6.85546 2.70002 90) (layer B.SilkS))
    (pad 2 smd rect (at 3.88874 0 90) (size 4.0005 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (pad 1 smd rect (at -3.88874 0 90) (size 4.0005 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 1 +48V))
    (model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeD_EIA-7343_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitors_SMD:C_1206 (layer B.Cu) (tedit 57E53A61)
    (at 151.892 106.172 270)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C13 (at 0.127 -2.413 270) (layer B.SilkS))
    (fp_text value 1u5 (at 0 -2.3 270) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0 270) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at 1.5 0 270) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206 (layer B.Cu) (tedit 57E539CC)
    (at 136.779 103.124 180)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C15 (at 0.381 -2.032 180) (layer B.SilkS))
    (fp_text value 1u5 (at 0 -2.3 180) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0 180) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 7 +24V))
    (pad 2 smd rect (at 1.5 0 180) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206 (layer B.Cu) (tedit 57E8C9D1)
    (at 161.671 98.044 270)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C10 (at -3.683 0 270) (layer B.SilkS))
    (fp_text value 1u5 (at 0 -2.3 270) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0 270) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at 1.5 0 270) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 14 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text EN (at 150.749 72.009) (layer F.SilkS))
  (gr_text . (at 147.32 82.042) (layer B.SilkS))
  (gr_text "VOUT\n+24V\n+12V" (at 144.78 94.488) (layer F.SilkS))
  (gr_text - (at 139.192 93.726) (layer F.SilkS))
  (gr_text + (at 139.192 98.806) (layer F.SilkS))
  (gr_text + (at 139.192 83.566) (layer F.SilkS))
  (gr_text - (at 139.192 88.646) (layer F.SilkS))
  (gr_text SYNCH (at 154.432 72.009) (layer F.SilkS))
  (gr_text VOUT (at 125.476 102.616) (layer F.SilkS))
  (gr_text VIN (at 124.968 79.756) (layer F.SilkS))
  (gr_line (start 123.444 110.998) (end 123.444 70.866) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 163.576 110.998) (end 123.444 110.998) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 163.576 70.866) (end 163.576 110.998) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 123.444 70.866) (end 163.576 70.866) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_text "STEPDOWN1A\nbe3D" (at 144.018 107.188) (layer F.SilkS))
  (zone (net 14) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 163.576 110.998) (xy 123.444 110.998) (xy 123.444 70.866) (xy 163.576 70.866) (xy 163.576 110.998)
      )
    )
  )
  (zone (net 14) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 163.576 110.998) (xy 123.444 110.998) (xy 123.444 70.866) (xy 163.576 70.866) (xy 163.576 110.998)
      )
    )
  )
  (zone (net 15) (net_name /EN) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.3)
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