(kicad_pcb (version 4) (host pcbnew "(2015-05-13 BZR 5653)-product")
  (general
    (links 41)
    (no_connects 0)
    (area 122.316429 64.77 156.718001 109.220001)
    (thickness 1.6)
    (drawings 18)
    (tracks 92)
    (zones 0)
    (modules 19)
    (nets 10)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.2)
    (user_trace_width 0.3)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (user_trace_width 0.6)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only yes)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.1)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.5 1.5)
    (pad_drill 0.6)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFF7F)
    (pcbplotparams
      (layerselection 0x010e0_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.300000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory ../CAM_PROFI/))
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad1)")
  (net 2 GND)
  (net 3 /+LED)
  (net 4 /-LED)
  (net 5 /DIM)
  (net 6 /EN)
  (net 7 "Net-(R1-Pad1)")
  (net 8 "Net-(R2-Pad1)")
  (net 9 "Net-(D1-Pad1)")
  (net_class Default "Toto je výchozí třída sítě."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /+LED)
    (add_net /-LED)
    (add_net /DIM)
    (add_net /EN)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(R1-Pad1)")
    (add_net "Net-(R2-Pad1)")
  )
  (module Mlab_R:SMD-0805 (layer B.Cu) (tedit 54799E0C)
    (at 136.652 89.916 270)
    (attr smd)
    (fp_text reference C1 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 1uF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_C:TantalC_SizeC_Reflow (layer B.Cu) (tedit 564C626B)
    (at 133.096 80.264 90)
    (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (attr smd)
    (fp_text reference C2 (at 0.254 -0.254 90) (layer B.SilkS))
    (fp_text value 4,7uF (at -0.09906 -3.59918 90) (layer B.SilkS) hide)
    (fp_text user + (at -4.99872 2.55016 90) (layer B.SilkS))
    (pad 2 smd rect (at 2.52476 0 90) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -2.52476 0 90) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 3 /+LED))
    (model MLAB_3D/Capacitors/c_tant_C.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_C:TantalC_SizeC_Reflow (layer B.Cu) (tedit 564C6262)
    (at 137.668 83.312 90)
    (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (attr smd)
    (fp_text reference C3 (at -0.254 0 90) (layer B.SilkS))
    (fp_text value 4,7uF (at -0.09906 -3.59918 90) (layer B.SilkS) hide)
    (fp_text user + (at -4.99872 2.55016 90) (layer B.SilkS))
    (pad 2 smd rect (at 2.52476 0 90) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 4 /-LED))
    (pad 1 smd rect (at -2.52476 0 90) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 3 /+LED))
    (model MLAB_3D/Capacitors/c_tant_C.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_D:Diode-MiniMELF_Standard (layer B.Cu) (tedit 547999ED)
    (at 139.446 90.17 90)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D1 (at 0 2.54 90) (layer B.SilkS))
    (fp_text value TMMBAT48 (at 0 -3.81 90) (layer B.SilkS) hide)
    (fp_text user A (at -1.80086 -1.5494 90) (layer B.SilkS))
    (fp_text user K (at 1.80086 -1.5494 90) (layer B.SilkS))
    (pad 1 smd rect (at -1.75006 0 90) (size 1.30048 1.69926) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at 1.75006 0 90) (size 1.30048 1.69926) (layers B.Cu B.Paste B.Mask)
      (net 3 /+LED))
    (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_Pin_Headers:Straight_1x02 (layer F.Cu) (tedit 564C5FE2)
    (at 128.27 96.266 90)
    (descr "pin header straight 1x02")
    (tags "pin header straight 1x02")
    (fp_text reference J1 (at 0 -3.81 90) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 3.81 90) (layer F.SilkS) hide)
    (fp_text user 1 (at -1.651 -1.27 90) (layer F.SilkS) hide)
    (pad 2 thru_hole rect (at 0 1.27 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 5 /DIM))
    (pad 1 thru_hole rect (at 0 -1.27 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 5 /DIM))
    (model Pin_Headers/Pin_Header_Straight_1x02.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_1x02 (layer F.Cu) (tedit 5535DB0D)
    (at 128.27 93.726 90)
    (descr "pin header straight 1x02")
    (tags "pin header straight 1x02")
    (fp_text reference J2 (at 0 -3.81 90) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 3.81 90) (layer F.SilkS) hide)
    (fp_text user 1 (at -1.651 -1.27 90) (layer F.SilkS) hide)
    (pad 2 thru_hole rect (at 0 1.27 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 6 /EN))
    (pad 1 thru_hole rect (at 0 -1.27 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 6 /EN))
    (model Pin_Headers/Pin_Header_Straight_1x02.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Con:WAGO256 (layer F.Cu) (tedit 564C6033)
    (at 136.906 99.314 90)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J3 (at -5.842 0 360) (layer F.SilkS))
    (fp_text value WAGO256 (at 0.254 4.064 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 180) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
    (pad 1 thru_hole rect (at 2.54 0 180) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
  )
  (module Mlab_Con:WAGO256 (layer F.Cu) (tedit 564C6037)
    (at 141.986 99.314 90)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J4 (at -5.842 0 180) (layer F.SilkS))
    (fp_text value WAGO256 (at 0.254 4.064 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0 180) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 1 thru_hole rect (at 2.54 0 180) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
  )
  (module Mlab_Pin_Headers:Straight_2x04 (layer F.Cu) (tedit 5535DB57)
    (at 128.27 81.28)
    (descr "pin header straight 2x04")
    (tags "pin header straight 2x04")
    (fp_text reference J5 (at 0 -6.35) (layer F.SilkS) hide)
    (fp_text value JUMP_4X2 (at 0 6.35) (layer F.SilkS) hide)
    (fp_text user 1 (at -2.921 -3.81) (layer F.SilkS))
    (pad 1 thru_hole rect (at -1.27 -3.81) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 2 thru_hole rect (at 1.27 -3.81) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 3 thru_hole rect (at -1.27 -1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
    (pad 4 thru_hole rect (at 1.27 -1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
    (pad 5 thru_hole rect (at -1.27 1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
    (pad 6 thru_hole rect (at 1.27 1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
    (pad 7 thru_hole rect (at -1.27 3.81) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 8 thru_hole rect (at 1.27 3.81) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (model Pin_Headers/Pin_Header_Straight_2x04.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Con:WAGO256 (layer F.Cu) (tedit 564C6021)
    (at 142.748 74.422 270)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J6 (at -5.588 0 540) (layer F.SilkS))
    (fp_text value WAGO256 (at 0.254 4.064 270) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 4 /-LED))
    (pad 1 thru_hole rect (at 2.54 0) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 4 /-LED))
  )
  (module Mlab_Con:WAGO256 (layer F.Cu) (tedit 564C6017)
    (at 137.668 74.422 270)
    (descr "WAGO-Series 236, 2Stift, 1pol, RM 5mm,")
    (tags "WAGO-Series 236, 2Stift, 1pol, RM 5mm, Anreibare Leiterplattenklemme")
    (fp_text reference J7 (at -5.588 0 360) (layer F.SilkS))
    (fp_text value WAGO256 (at 0.254 4.064 270) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.46 0) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
    (pad 1 thru_hole rect (at 2.54 0) (size 3.81 3.81) (drill 1.3) (layers *.Cu *.Mask F.SilkS)
      (net 3 /+LED))
  )
  (module Mlab_L:DE1205-10 (layer B.Cu) (tedit 564C61C4)
    (at 147.574 86.36 90)
    (descr "SMT capacitor, aluminium electrolytic, 10x10.5")
    (fp_text reference L1 (at 0.254 1.27 90) (layer B.SilkS))
    (fp_text value "DE1207-22 (22uH)" (at 0 -5.842 90) (layer B.SilkS) hide)
    (pad 1 smd rect (at 5 0 90) (size 3 5.5) (layers B.Cu B.Paste B.Mask)
      (net 4 /-LED))
    (pad 2 smd rect (at -5 0 90) (size 3 5.5) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D1-Pad1)"))
    (model Capacitors_SMD/c_elec_10x10_5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 5535DB2C)
    (at 149.84 102.108)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference P1 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value M3 (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 5535DB2C)
    (at 149.84 71.628)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference P2 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value M3 (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 5535DB2C)
    (at 129.54 71.628)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference P3 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value M3 (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 5535DB2C)
    (at 129.54 102.108)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference P4 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value M3 (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_R:SMD-0805 (layer B.Cu) (tedit 54799E0C)
    (at 132.334 94.234 270)
    (attr smd)
    (fp_text reference R1 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 0,565 (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(R1-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 (layer B.Cu) (tedit 54799E0C)
    (at 126.746 87.884 180)
    (attr smd)
    (fp_text reference R2 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 47k (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(R2-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 564C617D)
    (at 132.08 89.662)
    (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 0 0) (layer B.SilkS))
    (fp_text value LM3407 (at 0 -2.55) (layer B.Fab) hide)
    (pad 1 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(R1-Pad1)"))
    (pad 2 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 5 /DIM))
    (pad 3 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 6 /EN))
    (pad 4 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(R2-Pad1)"))
    (pad 5 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 3 /+LED))
    (pad 6 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 7 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 8 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D1-Pad1)"))
    (pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "LED OUT" (at 147.066 80.264 270) (layer F.SilkS))
  (gr_text 2015 (at 149.86 93.472 270) (layer F.SilkS))
  (gr_text JACHO (at 152.654 93.472 270) (layer F.SilkS))
  (gr_text MLAB.CZ (at 152.4 81.534 270) (layer F.SilkS))
  (gr_text PWMLED01B (at 149.86 81.534 270) (layer F.SilkS))
  (gr_text - (at 146.558 68.326) (layer F.SilkS))
  (gr_text + (at 133.858 68.58 270) (layer F.SilkS))
  (gr_text - (at 146.304 104.394) (layer F.SilkS))
  (gr_text + (at 133.096 104.648 270) (layer F.SilkS))
  (gr_text "POWER IN" (at 146.304 93.726 270) (layer F.SilkS))
  (gr_text "POWER IN" (at 132.588 81.026 270) (layer F.SilkS))
  (gr_text DIM (at 132.334 97.536 270) (layer F.SilkS))
  (gr_text EN (at 132.334 92.964 270) (layer F.SilkS))
  (gr_text MLAB.CZ (at 149.86 96.266) (layer B.Cu))
  (gr_line (start 124.716 106.932) (end 124.716 66.804) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 154.684 66.804) (end 124.716 66.804) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 154.684 106.932) (end 154.684 66.804) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 124.716 106.932) (end 154.684 106.932) (angle 90) (layer Edge.Cuts) (width 0.1))
  (zone (net 9) (net_name "Net-(D1-Pad1)") (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 133.35 90.932) (xy 134.874 92.456) (xy 135.128 92.71) (xy 135.382 92.964) (xy 150.368 92.964)
        (xy 150.368 89.662) (xy 142.748 89.662) (xy 140.97 91.186) (xy 138.43 91.186) (xy 137.414 91.948)
        (xy 136.144 91.948) (xy 135.128 90.932) (xy 135.128 90.424) (xy 133.35 90.424)
      )
    )
  )
  (zone (net 3) (net_name /+LED) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 140.462 89.154) (xy 138.43 89.154) (xy 138.43 87.63) (xy 136.398 87.63) (xy 135.382 88.9)
        (xy 133.096 88.9) (xy 133.096 84.836) (xy 132.334 84.328) (xy 131.064 84.328) (xy 130.048 83.566)
        (xy 125.984 83.566) (xy 125.984 78.994) (xy 130.81 78.994) (xy 131.572 80.264) (xy 132.08 80.264)
        (xy 133.604 80.264) (xy 134.62 78.994) (xy 134.62 75.692) (xy 135.382 74.93) (xy 139.7 74.93)
        (xy 139.7 79.248) (xy 136.144 79.248) (xy 136.144 80.264) (xy 136.144 83.566) (xy 136.144 84.328)
        (xy 138.43 84.328) (xy 138.938 84.328) (xy 139.7 84.328) (xy 140.462 85.09) (xy 140.462 89.154)
      )
    )
  )
  (zone (net 4) (net_name /-LED) (layer B.Cu) (hatch edge 0.508)
    (priority 2)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 136.398 79.502) (xy 139.7 79.502) (xy 140.462 78.994) (xy 140.462 74.93) (xy 145.034 74.93)
        (xy 150.622 79.502) (xy 150.622 83.058) (xy 136.906 83.058) (xy 136.398 82.55)
      )
    )
  )
  (zone (net 3) (net_name /+LED) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 134.874 103.886) (xy 138.938 103.886) (xy 138.938 94.742) (xy 138.938 90.17) (xy 130.81 78.994)
        (xy 125.984 78.994) (xy 125.984 83.566) (xy 130.302 83.566) (xy 134.874 90.424)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 123.19 65.786) (xy 155.702 65.786) (xy 155.448 107.95) (xy 124.206 107.95)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 122.682 64.77) (xy 156.718 65.024) (xy 155.956 109.22) (xy 123.444 108.204)
      )
    )
  )
  (zone (net 3) (net_name /+LED) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 139.7 75.184) (xy 139.7 70.104) (xy 139.7 69.85) (xy 135.382 69.85) (xy 135.382 75.184)
        (xy 139.7 75.184)
      )
    )
  )
  (zone (net 4) (net_name /-LED) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 140.462 75.184) (xy 140.462 69.85) (xy 145.034 69.85) (xy 145.034 75.184)
      )
    )
  )
)
